TYPES OF IC’s

DIP

  • Dual In-line Pins.
  • 3 basic formats: .3, .6 or .9 inch between rows.
  • Common number of pins:   

       .3”:6, 8, 14,16,18,20                                

       .6”:24, 28, 32 and 40                                              

       .9”:64.

  • The most common out line.
  • See figure1.

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SIP

  • Single In-line Pins.
  • Used for integrated amplifier and low-capacity memory IC’s.
  • Size and number of pins vary greatly.
  • See figure2.

ZIP

ZIP’s (Zigzag In-line Pins) are a modification of SIP; the pins are located in a single Zigzag pattern.

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PIN GRID ARRAY

  • Pin Grid Array.
  • A Ceramic IC with gold pins arranged in a 10*10 to 15*15 array on the.
  • Underside of the IC.
  • Different foot prints exist for different 16 and 32-bit microprocessor products (64 to 149 pins).
  • Requires a Socket.
  • See figures 5A, 5B and 5C.

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PLASTIC LEADED CHIP CARRIER

  • Plastic Leaded Chip Carrier.
  • A low-cost IC with its contacts of the perimeter of the IC. The contacts come out of the side and are wrapped around the underside of the IC.
  • Used for microprocessor and VLSI products.
  • 20 to 68 pins.
  • Requires a Socket.
  • See figures 6A and 6B.

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SMD

  • Surface-Mounted Devices.
  • Very hi-density packaging with the following features.
  • Small foot print.
  • Discrete components such as resistors, diodes are leadless.
  • Single-sided board.
  • Must be epoxied prior to wave-soldering.
  • Requires special soldering techniques.
  • Leads are flexible (SOJ and PLCC).
  • See figures 7A to 7E.

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PACKAGES

  • SOT for discrete components.
  • MLL for normally radial describe components.
  • DPAK for power transistors.
  • SO-8, 14 and 16 for diode and transistor arrays (SOICn).
  • SO-16, 18 and 20 for TTL logic, CMOS logic, linear and memory (SOICw).

 

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